TS27L2BMP vs 5962-9751002QPA feature comparison

TS27L2BMP STMicroelectronics

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5962-9751002QPA Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description TSSOP, TSSOP8,.25 CERAMIC, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0003 µA 0.0003 µA
Common-mode Reject Ratio-Nom 80 dB 83 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 3500 µV 2000 µV
JESD-30 Code R-PDSO-G8 R-GDIP-T8
JESD-609 Code e0
Length 4.4 mm 9.58 mm
Low-Bias YES YES
Low-Offset NO NO
Micropower YES YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP8,.25 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 5.08 mm
Slew Rate-Nom 0.04 V/us 0.25 V/us
Supply Current-Max 0.036 mA 0.27 mA
Supply Voltage Limit-Max 18 V 12 V
Supply Voltage-Nom (Vsup) 10 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 100 500
Voltage Gain-Min 40000 500
Wideband NO
Width 3 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code No
Screening Level MIL-PRF-38535 Class Q
Slew Rate-Min 0.1 V/us

Compare TS27L2BMP with alternatives

Compare 5962-9751002QPA with alternatives