TS824ILT-1.2
vs
LM4051BIM3-1.2-T
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOT-23
|
SOT-23
|
| Package Description |
TSOP,
|
TSSOP, TO-236
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.9 mm
|
2.92 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
1.241 V
|
1.2275 V
|
| Output Voltage-Min |
1.209 V
|
1.2226 V
|
| Output Voltage-Nom |
1.225 V
|
1.225 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.12 mm
|
1.12 mm
|
| Surface Mount |
YES
|
YES
|
| Temp Coef of Voltage-Max |
50 ppm/°C
|
50 ppm/°C
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.953 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trim/Adjustable Output |
NO
|
NO
|
| Width |
1.3 mm
|
1.3 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
4 Weeks
|
| Package Equivalence Code |
|
TO-236
|
| Technology |
|
BICMOS
|
| Voltage Tolerance-Max |
|
0.2%
|
|
|
|
Compare LM4051BIM3-1.2-T with alternatives