TSB12LV21AIPGF
vs
TSB12LV21BMPGF
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
PLASTIC, QFP-176
|
LFQFP, QFP176,1.0SQ,20
|
| Pin Count |
176
|
176
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
ALSO REQUIRES 4.5 TO 5.5 VOLTS
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
50 MHz
|
33 MHz
|
| Data Transfer Rate-Max |
50 MBps
|
50 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G176
|
S-PQFP-G176
|
| Length |
24 mm
|
24 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
176
|
176
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24 mm
|
24 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
1
|
| Communication Protocol |
|
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC
|
| Package Equivalence Code |
|
QFP176,1.0SQ,20
|
|
|
|
Compare TSB12LV21AIPGF with alternatives
Compare TSB12LV21BMPGF with alternatives