TXS0108ERGYR
vs
TXS0108EZXYR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
BGA
|
Package Description |
GREEN, PLASTIC, QFN-20
|
BGA-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
ALSO OPERATES WITH 1.65 TO 5.5 VOLT
|
ALSO OPERATES WITH 1.65 TO 5.5 VOLT
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
R-PQCC-N20
|
R-PBGA-B20
|
JESD-609 Code |
e4
|
e1
|
Length |
4.5 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Equivalence Code |
LCC20,.13X.18(UNSPEC)
|
BGA20,4X5,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.61 mm
|
Supply Current-Max |
0.008 mA
|
0.008 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.2 V
|
1.2 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.5 mm
|
2.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TXS0108ERGYR with alternatives
Compare TXS0108EZXYR with alternatives