U2763B-AFGG3
vs
BU8242F-E2
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
ROHM CO LTD
|
| Package Description |
SSO-20
|
SOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e3/e2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
75 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SOP
|
| Package Equivalence Code |
SSOP20,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
2.9 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN/TIN COPPER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
20
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
12.5 mm
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.9 mm
|
| Supply Current-Max |
|
8 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
| Width |
|
5.4 mm
|
|
|
|
Compare BU8242F-E2 with alternatives