U3600BM
vs
LMX4168FLQ/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SSOP, SO44(UNSPEC)
|
HVQCCN,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G44
|
S-XQCC-N44
|
| JESD-609 Code |
e0
|
e3
|
| Length |
17.925 mm
|
7 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
60 °C
|
| Operating Temperature-Min |
-25 °C
|
-10 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SSOP
|
HVQCCN
|
| Package Equivalence Code |
SO44(UNSPEC)
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
29 mA
|
|
| Supply Voltage-Nom |
3.6 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.4 mm
|
7 mm
|
| Base Number Matches |
7
|
1
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.8 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare U3600BM with alternatives
Compare LMX4168FLQ/NOPB with alternatives