U7004B
vs
TG2403CT
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELEFUNKEN MICROELECTRONICS GMBH
|
TOSHIBA CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Equivalence Code |
SSOP20,.25
|
|
| Power Supplies |
3.6 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
GAAS
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
HVBCC,
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
R-XBCC-B20
|
| Length |
|
3.9 mm
|
| Number of Functions |
|
1
|
| Package Code |
|
HVBCC
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.53 mm
|
| Supply Current-Max |
|
180 mA
|
| Supply Voltage-Nom |
|
3 V
|
| Telecom IC Type |
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BUTT
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
2.9 mm
|
|
|
|
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