U74HC00G-S14-R vs TC74HC132AP feature comparison

U74HC00G-S14-R Unisonic Technologies Co Ltd

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TC74HC132AP Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer UNISONIC TECHNOLOGIES CO LTD TOSHIBA CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e3
Length 8.65 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0052 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 18 ns 28 ns
Propagation Delay (tpd) 90 ns 140 ns
Schmitt Trigger NO YES
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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