U74HC00L-P14-R vs MM74HC00J feature comparison

U74HC00L-P14-R Unisonic Technologies Co Ltd

Buy Now Datasheet

MM74HC00J National Semiconductor Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer UNISONIC TECHNOLOGIES CO LTD NATIONAL SEMICONDUCTOR CORP
Part Package Code TSSOP
Package Description TSSOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 5 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0052 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 18 ns
Propagation Delay (tpd) 90 ns 23 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 7.62 mm
Base Number Matches 1 2
JESD-609 Code e0
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD

Compare U74HC00L-P14-R with alternatives

Compare MM74HC00J with alternatives