UAA3545HL vs ML2726DH feature comparison

UAA3545HL NXP Semiconductors

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ML2726DH Qorvo

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS QORVO INC
Part Package Code QFP
Package Description LFQFP, QFP32,.28SQ,20 TQFP, TQFP32,.35SQ,32
Pin Count 32
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 S-PQFP-G32
JESD-609 Code e3 e3
Length 5 mm 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 60 °C 60 °C
Operating Temperature-Min -10 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP TQFP
Package Equivalence Code QFP32,.28SQ,20 TQFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.2 mm
Supply Current-Max 44 mA 0.076 mA
Supply Voltage-Nom 3.2 V 3.3 V
Surface Mount YES YES
Technology BICMOS BICMOS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 5 mm 7 mm
Base Number Matches 2 2

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