UC2526ANG4
vs
SG1526BJ-883B
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP-18
|
DIP-18
|
Pin Count |
18
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
LG-MAX
|
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
VOLTAGE-MODE
|
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
35 V
|
35 V
|
Input Voltage-Min |
7 V
|
8 V
|
Input Voltage-Nom |
15 V
|
15 V
|
JESD-30 Code |
R-PDIP-T18
|
R-CDIP-T18
|
JESD-609 Code |
e4
|
e0
|
Length |
22.48 mm
|
24.38 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
18
|
18
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-25 °C
|
-55 °C
|
Output Current-Max |
0.2 A
|
0.02 A
|
Output Voltage-Max |
5.05 V
|
5.05 V
|
Output Voltage-Min |
4.95 V
|
4.95 V
|
Output Voltage-Nom |
5 V
|
5 V
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP18,.3
|
DIP18,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
35 V
|
|
Supply Voltage-Min (Vsup) |
7 V
|
|
Surface Mount |
NO
|
NO
|
Switcher Configuration |
BUCK-BOOST
|
PUSH-PULL
|
Switching Frequency-Max |
600 kHz
|
500 kHz
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare UC2526ANG4 with alternatives
Compare SG1526BJ-883B with alternatives