UCC5618QP
vs
UCC5618PWP
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QLCC
|
SSOP
|
| Package Description |
GREEN, PLASTIC, LCC-28
|
GREEN, TSSOP-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
NO
|
NO
|
| Interface IC Type |
SCSI BUS TERMINATOR
|
SCSI BUS TERMINATOR
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e4
|
| Length |
11.5062 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Signal Lines |
18
|
18
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TSSOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
SSOP28,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Pull-up Resistance-Nom |
110 Ω
|
110 Ω
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
1.2 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4 V
|
4 V
|
| Supply Voltage-Nom |
4.75 V
|
4.75 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
11.5062 mm
|
4.4 mm
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare UCC5618QP with alternatives
Compare UCC5618PWP with alternatives