UCD3138RJAT
vs
DS1832
feature comparison
|
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Datasheet
|
DS1832
Dallas Semiconductor
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Datasheet
|
| Source Content uid |
UCD3138RJAT
|
|
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
DALLAS SEMICONDUCTOR
|
| Package Description |
HVQCCN,
|
0.300 INCH, DIP-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Date Of Intro |
2016-10-28
|
|
| Adjustable Threshold |
NO
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
S-PQCC-N40
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
6 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
3
|
| Number of Outputs |
8
|
|
| Number of Terminals |
40
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
WATCHDOG TIMER
|
| Package Equivalence Code |
|
DIP8,.3
|
| Power Supplies |
|
1.2/5.5 V
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max (Isup) |
|
0.035 mA
|
| Technology |
|
CMOS
|
| Threshold Voltage-Nom |
|
+2.55/2.88V
|
|
|
|
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