UCN5801A vs MIC58P01YV feature comparison

UCN5801A Allegro MicroSystems LLC

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MIC58P01YV Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ALLEGRO MICROSYSTEMS LLC MICROCHIP TECHNOLOGY INC
Part Package Code DIP
Package Description 0.400 INCH, DIP-22 LCC-28
Pin Count 22
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Allegro Microsystems Microchip
Built-in Protections TRANSIENT TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits 8 8
Input Characteristics STANDARD STANDARD
Interface IC Type LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T22 S-PQCC-J28
JESD-609 Code e3 e3
Length 27.555 mm 11.48 mm
Number of Functions 1 8
Number of Terminals 22 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Output Current Flow Direction SINK SINK
Output Current-Max 0.35 A
Output Peak Current Limit-Nom 0.5 A 0.5 A
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP22,.4 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 4.57 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIMOS BICMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 10.16 mm 11.48 mm
Base Number Matches 1 2
Factory Lead Time 8 Weeks
Additional Feature SEATED HT-CALCULATED
Moisture Sensitivity Level 2
Screening Level TS 16949
Supply Current-Max 10 mA

Compare UCN5801A with alternatives

Compare MIC58P01YV with alternatives