UCN5810LWF vs UCN5810AF feature comparison

UCN5810LWF Allegro MicroSystems LLC

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UCN5810AF Allegro MicroSystems LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLEGRO MICROSYSTEMS LLC ALLEGRO MICROSYSTEMS LLC
Part Package Code SOIC DIP
Package Description SOP, SOP18,.4 DIP, DIP18,.3
Pin Count 18 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Data Input Mode SERIAL SERIAL
Interface IC Type VACUUM FLUORESCENT DISPLAY DRIVER VACUUM FLUORESCENT DISPLAY DRIVER
JESD-30 Code R-PDSO-G18 R-PDIP-T18
JESD-609 Code e0 e0
Length 11.55 mm 22.86 mm
Multiplexed Display Capability NO NO
Number of Functions 1 1
Number of Segments 10 10
Number of Terminals 18 18
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP18,.4 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 5.33 mm
Supply Current-Max 2.5 mA 2.5 mA
Supply Voltage-Nom 5 V 5 V
Supply Voltage1-Nom 60 V 60 V
Surface Mount YES NO
Technology BIMOS BIMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.62 mm
fmax-Min 3.3 MHz 3.3 MHz
Base Number Matches 3 2

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