UCN5841A vs MIC5841BWM feature comparison

UCN5841A Allegro MicroSystems LLC

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MIC5841BWM Micrel Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLEGRO MICROSYSTEMS LLC MICREL INC
Part Package Code DIP SOIC
Package Description DIP, DIP18,.3 SOIC-18
Pin Count 18 18
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT TRANSIENT
Driver Number of Bits 8 8
Interface IC Type SIPO BASED PERIPHERAL DRIVER SIPO BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T18 R-PDSO-G18
JESD-609 Code e0 e0
Length 22.86 mm 11.55 mm
Number of Functions 1 1
Number of Terminals 18 18
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Current Flow Direction SINK SINK
Output Current-Max 0.35 A 0.35 A
Output Peak Current Limit-Nom 0.5 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3 SOP18,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 2.65 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIMOS BICMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
Base Number Matches 1 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 240
Supply Voltage-Max 12 V
Time@Peak Reflow Temperature-Max (s) 30

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Compare MIC5841BWM with alternatives