UDK2559EB
vs
L6221CN
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
STMICROELECTRONICS
|
Part Package Code |
LCC
|
ZFM
|
Package Description |
PLASTIC, MS-018AB, LCC-28
|
DIP, DIP16,.3
|
Pin Count |
28
|
15
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Allegro Microsystems
|
|
Built-in Protections |
TRANSIENT; OVER CURRENT; THERMAL
|
|
Driver Number of Bits |
4
|
4
|
Input Characteristics |
STANDARD
|
|
Interface IC Type |
AND GATE BASED PERIPHERAL DRIVER
|
AND GATE BASED PERIPHERAL DRIVER
|
JESD-30 Code |
S-PQCC-J28
|
R-PZFM-T15
|
JESD-609 Code |
e0
|
e3
|
Length |
11.51 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
4
|
4
|
Number of Terminals |
28
|
15
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-COLLECTOR
|
|
Output Current Flow Direction |
SINK
|
SINK
|
Output Current-Max |
0.7 A
|
1.8 A
|
Output Peak Current Limit-Nom |
1 A
|
3.2 A
|
Output Polarity |
INVERTED
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC28,.5SQ
|
DIP16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
ZIG-ZAG
|
Turn-on Time |
20 µs
|
2000 µs
|
Width |
11.51 mm
|
|
Base Number Matches |
4
|
2
|
Turn-off Time |
|
5 µs
|
|
|
|
Compare UDK2559EB with alternatives
Compare L6221CN with alternatives