UPC8002GR-E1
vs
U7004B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEC ELECTRONICS CORP
|
TELEFUNKEN MICROELECTRONICS GMBH
|
Part Package Code |
SSOP
|
|
Package Description |
LSSOP,
|
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PDSO-G20
|
|
JESD-609 Code |
e0
|
e0
|
Number of Functions |
1
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-30 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.45 mm
|
|
Supply Current-Max |
2.2 mA
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
4
|
Mounting Feature |
|
SURFACE MOUNT
|
Package Equivalence Code |
|
SSOP20,.25
|
Power Supplies |
|
3.6 V
|
|
|
|
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