UPC8125GR-E1 vs BU8242FT2 feature comparison

UPC8125GR-E1 NEC Electronics Group

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BU8242FT2 ROHM Semiconductor

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NEC ELECTRONICS CORP ROHM CO LTD
Part Package Code SSOP SOIC
Package Description SSOP, SOP,
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.9 mm
Supply Current-Max 48 mA 8 mA
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.4 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3/e2
Length 12.5 mm
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN/TIN COPPER
Time@Peak Reflow Temperature-Max (s) 10

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