UPD48576218FF-E24-DW1-A vs MT49H32M18HU-25 feature comparison

UPD48576218FF-E24-DW1-A Renesas Electronics Corporation

Buy Now Datasheet

MT49H32M18HU-25 Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TBGA, BGA144,12X18,40/32 FBGA-144
Pin Count 144 144
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.3 ns
Additional Feature AUTO REFRESH AUTO REFRESH
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR1 DRAM DDR DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 32MX18 32MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.17 mm 1.2 mm
Sequential Burst Length 2,4,8
Standby Current-Max 0.055 A
Supply Current-Max 0.872 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
JESD-609 Code e0
Operating Temperature-Max 95 °C
Operating Temperature-Min
Temperature Grade OTHER
Terminal Finish TIN LEAD SILVER

Compare UPD48576218FF-E24-DW1-A with alternatives

Compare MT49H32M18HU-25 with alternatives