UPD48576218FF-E24-DW1-A vs UPD48576218FF-E25-DW1-A feature comparison

UPD48576218FF-E24-DW1-A Renesas Electronics Corporation

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UPD48576218FF-E25-DW1-A Renesas Electronics Corporation

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Rohs Code Yes Yes
Part Life Cycle Code End Of Life Active
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code BGA BGA
Package Description TBGA, BGA144,12X18,40/32 TBGA, BGA144,12X18,40/32
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.3 ns 0.3 ns
Additional Feature AUTO REFRESH AUTO REFRESH
Clock Frequency-Max (fCLK) 400 MHz 400 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 32MX18 32MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA144,12X18,40/32 BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.17 mm 1.17 mm
Sequential Burst Length 2,4,8 2,4,8
Standby Current-Max 0.055 A 0.055 A
Supply Current-Max 0.872 mA 0.872 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1

Compare UPD48576218FF-E24-DW1-A with alternatives

Compare UPD48576218FF-E25-DW1-A with alternatives