USB3300-EZK-TR
vs
USB3300I-EZK-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
STANDARD MICROSYSTEMS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
5 X 5 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-32
|
QFN-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
SMSC
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N32
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare USB3300-EZK-TR with alternatives
Compare USB3300I-EZK-TR with alternatives