V62/07616-03XE
vs
MIC45116-1YMP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
TSSOP
|
|
Package Description |
HTSSOP,
|
QFN-52
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
|
Input Voltage-Max |
20 V
|
20 V
|
Input Voltage-Min |
4.5 V
|
4.75 V
|
Input Voltage-Nom |
12 V
|
12 V
|
JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N52
|
JESD-609 Code |
e4
|
|
Length |
5 mm
|
8 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
|
Number of Terminals |
16
|
52
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Current-Max |
6.5 A
|
6 A
|
Output Voltage-Max |
1.8 V
|
17 V
|
Output Voltage-Min |
1.8 V
|
0.8 V
|
Output Voltage-Nom |
1.8 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HTSSOP
|
HQCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
3 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
700 kHz
|
750 kHz
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4.4 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
LCC52(UNSPEC)
|
Supply Current-Max (Isup) |
|
0.75 mA
|
|
|
|
Compare V62/07616-03XE with alternatives
Compare MIC45116-1YMP with alternatives