VP2410LTR vs BSS192,135 feature comparison

VP2410LTR Temic Semiconductors

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BSS192,135 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEMIC SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description CYLINDRICAL, O-PBCY-W3 SMALL OUTLINE, R-PSSO-F3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 240 V 240 V
Drain Current-Max (ID) 0.18 A 0.2 A
Drain-source On Resistance-Max 10 Ω 12 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 15 pF 15 pF
JEDEC-95 Code TO-226AA TO-243AA
JESD-30 Code O-PBCY-W3 R-PSSO-F3
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style CYLINDRICAL SMALL OUTLINE
Polarity/Channel Type P-CHANNEL P-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Terminal Form WIRE FLAT
Terminal Position BOTTOM SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Source Content uid BSS192,135
Rohs Code Yes
Part Package Code SOT-89
Pin Count 3
Manufacturer Package Code SOT89
HTS Code 8541.21.00.75
Additional Feature CMOS COMPATIBLE
Case Connection DRAIN
Drain Current-Max (Abs) (ID) 0.2 A
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 1 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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