VSC7421XJQ-04
vs
VSC7428XJG-02
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFP,
|
BGA-672
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
5A991.C
|
| Factory Lead Time |
|
4 Weeks
|
| JESD-30 Code |
|
S-PBGA-B672
|
| Length |
|
27 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
672
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HBGA
|
| Package Equivalence Code |
|
BGA672,26X26,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
| Seated Height-Max |
|
2.44 mm
|
| Supply Current-Max |
|
2100 mA
|
| Supply Voltage-Nom |
|
1 V
|
| Surface Mount |
|
YES
|
| Telecom IC Type |
|
ETHERNET SWITCH
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
27 mm
|
|
|
|
Compare VSC7421XJQ-04 with alternatives
Compare VSC7428XJG-02 with alternatives