VSC8257YMR-01
vs
AQR108-B0-EG-Y
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AQUANTIA CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A991.B
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Data Rate |
10000000 Mbps
|
|
| JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B104
|
| Length |
17 mm
|
11 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
104
|
| Number of Transceivers |
4
|
|
| Operating Temperature-Max |
110 °C
|
108 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
2.7 mm
|
1.57 mm
|
| Supply Voltage-Nom |
1 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
7 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Package Description |
|
LFBGA,
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare VSC8257YMR-01 with alternatives
Compare AQR108-B0-EG-Y with alternatives