VSC8486SN
vs
KSZ8895RQXC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA,
|
FQFP,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-13
|
2016-08-12
|
JESD-30 Code |
S-PBGA-B256
|
R-PQFP-G128
|
Length |
17 mm
|
20 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
128
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FQFP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
Seated Height-Max |
3.22 mm
|
3.4 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
17 mm
|
14 mm
|
Base Number Matches |
1
|
5
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
9 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e3
|
Package Equivalence Code |
|
QFP128,.68X.91,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare VSC8486SN with alternatives
Compare KSZ8895RQXC with alternatives