VSC8486SN
vs
LAN88730AMR-C-V01
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA,
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-13
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PQCC-N32
|
Length |
17 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
3.22 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.2 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
17 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Data Rate |
|
100000 Mbps
|
JESD-609 Code |
|
e3
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
LCC32,.2SQ,20
|
Screening Level |
|
TS 16949
|
Supply Current-Max |
|
28.5 mA
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare VSC8486SN with alternatives
Compare LAN88730AMR-C-V01 with alternatives