VSC8488XJU-15
vs
KSZ8895ML
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FCBGA-196
|
LFQFP,
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B196
|
S-PQFP-G128
|
Number of Functions |
1
|
1
|
Number of Terminals |
196
|
128
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Position |
BOTTOM
|
QUAD
|
Base Number Matches |
1
|
10
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e3
|
Length |
|
14 mm
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Seated Height-Max |
|
1.6 mm
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Pitch |
|
0.4 mm
|
Width |
|
14 mm
|
|
|
|
Compare VSC8488XJU-15 with alternatives
Compare KSZ8895ML with alternatives