VSC8488XJU-15
vs
LAN88730AMR-C-V01
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
FCBGA-196
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B196
|
S-PQCC-N32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
196
|
32
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Data Rate |
|
100000 Mbps
|
| JESD-609 Code |
|
e3
|
| Length |
|
5 mm
|
| Number of Transceivers |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
0.9 mm
|
| Supply Current-Max |
|
28.5 mA
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
5 mm
|
|
|
|
Compare VSC8488XJU-15 with alternatives
Compare LAN88730AMR-C-V01 with alternatives