VSC8504XKS-02
vs
88E1145-E1-BBM1C000
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MARVELL SEMICONDUCTOR INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Data Rate |
1000000 Mbps
|
1000000 Mbps
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
|
| Number of Transceivers |
4
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
UNSPECIFIED
|
| Package Style |
GRID ARRAY
|
|
| Seated Height-Max |
1.8 mm
|
|
| Supply Current-Max |
900 mA
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
| Terminal Form |
BALL
|
UNSPECIFIED
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
17 mm
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
PACKAGE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare VSC8504XKS-02 with alternatives
Compare 88E1145-E1-BBM1C000 with alternatives