VSC8514XMK-14
vs
BCM53106SIFBG
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
BROADCOM INC
|
| Package Description |
QFN-138
|
TFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2018-08-21
|
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBCC-B138
|
S-PBGA-B212
|
| Length |
12 mm
|
11 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
138
|
212
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-45 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVBCC
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
0.85 mm
|
1.017 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
BUTT
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
12 mm
|
11 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| Technology |
|
CMOS
|
| Terminal Pitch |
|
0.65 mm
|
|
|
|
Compare VSC8514XMK-14 with alternatives
Compare BCM53106SIFBG with alternatives