VSC8522XJQ-04
vs
VSC8574XKS-05
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
HTFQFP,
|
BGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
Microsemi Corporation
|
JESD-30 Code |
S-PQFP-G302
|
S-PBGA-B256
|
Length |
24 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
302
|
256
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Seated Height-Max |
1.2 mm
|
1.8 mm
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.4 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
24 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare VSC8522XJQ-04 with alternatives
Compare VSC8574XKS-05 with alternatives