VSC8641XKO
vs
88E1111-B2-BAB1C000
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MARVELL SEMICONDUCTOR INC
|
| Package Description |
LQFP-100
|
ROHS COMPLIANT, TFBGA-117
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| JESD-30 Code |
S-PQFP-G100
|
R-PBGA-B117
|
| Length |
12 mm
|
14 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
117
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLFQFP
|
LBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Seated Height-Max |
1.6 mm
|
1.54 mm
|
| Supply Voltage-Nom |
1.2 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.4 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
12 mm
|
10 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
117
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e1
|
| Number of Transceivers |
|
1
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare VSC8641XKO with alternatives
Compare 88E1111-B2-BAB1C000 with alternatives