W25Q16DVSNIP vs W25Q16DVSNBG feature comparison

W25Q16DVSNIP Winbond Electronics Corp

Buy Now Datasheet

W25Q16DVSNBG Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description SOIC-8 0.150 INCH, GREEN, SOIC-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 80 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 16MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 2.7 V
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Samacsys Manufacturer Winbond
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3
Package Equivalence Code SOP8,.25
Qualification Status Not Qualified
Screening Level AEC-Q100
Serial Bus Type SPI
Standby Current-Max 0.000025 A
Supply Current-Max 0.03 mA
Terminal Finish MATTE TIN
Write Protection HARDWARE/SOFTWARE

Compare W25Q16DVSNIP with alternatives

Compare W25Q16DVSNBG with alternatives