W25Q16DVSNIP vs W25Q16DVSNIG feature comparison

W25Q16DVSNIP Winbond Electronics Corp

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W25Q16DVSNIG Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description SOIC-8 SOIC-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 5 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 2.7 V
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 3.9 mm 4 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Winbond
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.000005 A
Supply Current-Max 0.025 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Write Protection HARDWARE/SOFTWARE

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