W25Q64JVSSIQ vs M25PX64STVME6TA feature comparison

W25Q64JVSSIQ Winbond Electronics Corp

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M25PX64STVME6TA Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description SOIC-8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Additional Feature 2.7V TO 3V @ 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8
JESD-609 Code e3
Length 5.28 mm
Memory Density 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.3
Package Shape SQUARE
Package Style SMALL OUTLINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V 2.7 V
Seated Height-Max 2.16 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.018 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 5.28 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1

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Compare M25PX64STVME6TA with alternatives