W25Q64JVSSIQ vs S25FL164K0XNFIQ11 feature comparison

W25Q64JVSSIQ Winbond Electronics Corp

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S25FL164K0XNFIQ11 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP SPANSION INC
Package Description SOIC-8 5 X 6 MM, GREEN, WSON-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Additional Feature 2.7V TO 3V @ 104MHZ ALSO CONFIGURABLE AS 64M X 1
Alternate Memory Width 1 2
Clock Frequency-Max (fCLK) 133 MHz 108 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 R-PDSO-N8
JESD-609 Code e3 e3
Length 5.28 mm 6 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 4
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 16777216 words
Number of Words Code 8000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 16MX4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVSON
Package Equivalence Code SOP8,.3
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V 3 V
Seated Height-Max 2.16 mm 0.8 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.018 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 5.28 mm 5 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1

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