W25Q64JVSSIQ vs W25Q64FVSTIQ feature comparison

W25Q64JVSSIQ Winbond Electronics Corp

Buy Now Datasheet

W25Q64FVSTIQ Winbond Electronics Corp

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description SOIC-8 0.208 INCH, GREEN, VSOP-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond Winbond
Additional Feature 2.7V TO 3V @ 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz 104 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e3
Length 5.28 mm 5.28 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 67108864 words
Number of Words Code 8000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 64MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP VSOP
Package Equivalence Code SOP8,.3
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V 3 V
Seated Height-Max 2.16 mm 1 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.018 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 5.28 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 2 1

Compare W25Q64JVSSIQ with alternatives

Compare W25Q64FVSTIQ with alternatives