W25X32-VSSI-Z
vs
M25P32-VMW3GBA
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
MICRON TECHNOLOGY INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
0.208 INCH, ROHS COMPLIANT, SOIC-8
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
Clock Frequency-Max (fCLK) |
33 MHz
|
|
JESD-30 Code |
S-PDSO-G8
|
|
JESD-609 Code |
e3
|
|
Length |
5.283 mm
|
|
Memory Density |
33554432 bit
|
|
Memory IC Type |
FLASH
|
|
Memory Width |
1
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
|
Number of Words |
33554432 words
|
|
Number of Words Code |
32000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
32MX1
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
SOP
|
|
Package Shape |
SQUARE
|
|
Package Style |
SMALL OUTLINE
|
|
Parallel/Serial |
SERIAL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
2.7 V
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.16 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
5.283 mm
|
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
|
|
|
Compare W25X32-VSSI-Z with alternatives
Compare M25P32-VMW3GBA with alternatives