WL1801MODGBMOC
vs
WL1801MODGBMOCT
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
BGA,
|
MOC-100
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PBGA-B130
|
R-PBGA-B100
|
| Length |
13.4 mm
|
13.4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
130
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Supply Voltage-Nom |
3.7 V
|
3.7 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BUTT
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13.3 mm
|
13.3 mm
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| ECCN Code |
|
5A992.C
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Data Rate |
|
100000 Mbps
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
LGA100(UNSPEC)
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Pitch |
|
0.7 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare WL1801MODGBMOC with alternatives
Compare WL1801MODGBMOCT with alternatives