WL1801MODGBMOC
vs
XWL1801MODGAMOCT
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
BGA,
|
LGA,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PBGA-B130
|
R-PBGA-N100
|
Length |
13.4 mm
|
13.4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
130
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Seated Height-Max |
2 mm
|
2 mm
|
Supply Voltage-Nom |
3.7 V
|
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13.3 mm
|
13.3 mm
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
No
|
Terminal Pitch |
|
0.7 mm
|
|
|
|
Compare WL1801MODGBMOC with alternatives
Compare XWL1801MODGAMOCT with alternatives