WL1801MODGBMOC
vs
BM83SM1-00AB
feature comparison
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Package Description |
BGA,
|
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PBGA-B130
|
|
| Length |
13.4 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
130
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY
|
|
| Seated Height-Max |
2 mm
|
|
| Supply Voltage-Nom |
3.7 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13.3 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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