WL1801MODGBMOCR
vs
BM83SM1-00AB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Package Description |
LGA, LGA100(UNSPEC)
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Rate |
100000 Mbps
|
|
| JESD-30 Code |
R-PBGA-B100
|
|
| JESD-609 Code |
e4
|
|
| Length |
13.4 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LGA
|
|
| Package Equivalence Code |
LGA100(UNSPEC)
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2 mm
|
|
| Supply Voltage-Nom |
3.7 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
BUTT
|
|
| Terminal Pitch |
0.7 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
13.3 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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