WL1801MODGBMOCT vs BM83SM1-00AB feature comparison

WL1801MODGBMOCT Texas Instruments

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BM83SM1-00AB

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Source Content uid WL1801MODGBMOCT
Rohs Code No
Part Life Cycle Code Active
Package Description LGA, LGA100(UNSPEC)
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Data Rate 100000 Mbps
JESD-30 Code R-PBGA-B100
JESD-609 Code e4
Length 13.4 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 100
Operating Temperature-Max 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY
Package Code LGA
Package Equivalence Code LGA100(UNSPEC)
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Power Supplies 2.9/4.8 V
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Nom 3.7 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Temperature Grade COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form BUTT
Terminal Pitch 0.7 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13.3 mm
Base Number Matches 1

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