WL1805MODGBMOC vs XWL1801MODGAMOCT feature comparison

WL1805MODGBMOC Texas Instruments

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XWL1801MODGAMOCT Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description BGA, LGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PBGA-B130 R-PBGA-N100
Length 13.4 mm 13.4 mm
Number of Functions 1 1
Number of Terminals 130 100
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Seated Height-Max 2 mm 2 mm
Supply Voltage-Nom 3.7 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER OTHER
Terminal Form BALL NO LEAD
Terminal Position BOTTOM BOTTOM
Width 13.3 mm 13.3 mm
Base Number Matches 1 1
Pbfree Code No
Terminal Pitch 0.7 mm

Compare WL1805MODGBMOC with alternatives

Compare XWL1801MODGAMOCT with alternatives