WL1805MODGBMOCT
vs
WL1835MODGBMOCR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
MOC-100
|
MOC-100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8473.30.11.80
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Data Rate |
100000 Mbps
|
100000 Mbps
|
JESD-30 Code |
R-PBGA-B100
|
R-PBGA-B100
|
JESD-609 Code |
e4
|
e4
|
Length |
13.4 mm
|
13.4 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LGA
|
LGA
|
Package Equivalence Code |
LGA100(UNSPEC)
|
LGA100(UNSPEC)
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
2 mm
|
Supply Voltage-Nom |
3.7 V
|
3.7 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
BUTT
|
BUTT
|
Terminal Pitch |
0.7 mm
|
0.7 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
13.3 mm
|
13.3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare WL1805MODGBMOCT with alternatives
Compare WL1835MODGBMOCR with alternatives