WL1835MODGBMOCT vs XWL1805MODGAMOCR feature comparison

WL1835MODGBMOCT Texas Instruments

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XWL1805MODGAMOCR Texas Instruments

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description MOC-100 BGA,
Reach Compliance Code compliant unknown
ECCN Code 5A992.C
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Data Rate 100000 Mbps
JESD-30 Code R-PBGA-B100 R-PBGA-B130
JESD-609 Code e4
Length 13.4 mm 13.4 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 130
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LGA BGA
Package Equivalence Code LGA100(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Nom 3.7 V 3.7 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade COMMERCIAL OTHER
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form BUTT BALL
Terminal Pitch 0.7 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13.3 mm 13.3 mm
Base Number Matches 1 1

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Compare XWL1805MODGAMOCR with alternatives