X28HC256JZ-90T1
vs
FT28HC256E-90LMB-AT
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
FORCE TECHNOLOGIES LTD
|
| Part Package Code |
PDIP, PLCC, SOIC
|
QFJ
|
| Package Description |
QCCJ, LDCC32,.5X.6
|
QCCN,
|
| Pin Count |
28, 32, 28
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
26 Weeks
|
|
| Access Time-Max |
90 ns
|
90 ns
|
| Command User Interface |
NO
|
|
| Data Polling |
YES
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-CQCC-N32
|
| JESD-609 Code |
e3
|
|
| Length |
13.97 mm
|
13.97 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QCCN
|
| Package Equivalence Code |
LDCC32,.5X.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Page Size |
128 words
|
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.55 mm
|
2.54 mm
|
| Standby Current-Max |
0.0005 A
|
|
| Supply Current-Max |
0.06 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Toggle Bit |
YES
|
|
| Width |
11.43 mm
|
11.43 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare X28HC256JZ-90T1 with alternatives
Compare FT28HC256E-90LMB-AT with alternatives