X66AK2G12ABY60
vs
66AK2G12ABY60
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
LFBGA, BGA625,25X25,32
|
LFBGA, BGA625,25X25,32
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2017-11-29
|
|
JESD-30 Code |
S-PBGA-B625
|
S-PBGA-B625
|
Length |
21 mm
|
21 mm
|
Number of Terminals |
625
|
625
|
Operating Temperature-Max |
70 °C
|
90 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA625,25X25,32
|
BGA625,25X25,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
1.56 mm
|
1.56 mm
|
Supply Voltage-Max |
0.945 V
|
0.945 V
|
Supply Voltage-Min |
0.855 V
|
0.855 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
21 mm
|
21 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
Texas Instruments
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare X66AK2G12ABY60 with alternatives
Compare 66AK2G12ABY60 with alternatives